Dual camera module and optical device

ABSTRACT

The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/934,804, filed Jul. 21, 2020; which is a continuation of U.S. patentapplication Ser. No. 15/740,711, filed Dec. 28, 2017, now U.S. Pat. No.10,761,292, issued Sep. 1, 2020; which is the U.S. national stageapplication of International Patent Application No. PCT/KR2016/006762,filed Jun. 24, 2016, which claims priority to Korean Patent ApplicationNos. 10-2015-0092364, filed Jun. 29, 2015; 10-2015-0092587, filed Jun.30, 2015; and 10-2015-0112497, filed Aug. 10, 2015, the disclosures ofeach of which are incorporated herein by reference in their entirety.

TECHNICAL FIELD

The teachings in accordance with exemplary and non-limiting embodimentsof this invention relate generally to a dual camera module and anoptical apparatus.

BACKGROUND ART

Concomitant with widely generalized dissemination of various mobileterminals and commercialization of wireless Internet services, demandsby consumers related to mobile terminals are diversified to promptvarious types of peripheral devices or additional equipment to bemounted on mobile terminals. Inter alia, camera modules may berepresentative items photographing an object in a still picture or avideo. Recently, a dual camera module has been developed, as one type ofcamera module, to obtain a high quality of photographs or images througha digital zoom relative to an object at a proximate distance and at along distance as well.

However, the dual camera module suffers from a disadvantage in that aninner structure of a wide angle camera module is exposed through a broadwindow required to obtain a view angle of the wide angle camera module,thereby causing a damage in terms of design aspect. Furthermore, theconventional dual camera module was formed with a large PCB (PrintedCircuit Board) in order to respectively provide an electrical conductivestructure for connecting optical elements such as a camera module, apower source, and a controller, the configuration of whichproblematically results in increased total length of the dual cameramodule.

DETAILED DESCRIPTION OF THE INVENTION TECHNICAL SUBJECT

In order to solve the abovementioned problems/disadvantages, exemplaryembodiments of the present invention provide a dual camera moduleminimized in inner structure exposure of a wider angle camera module.Furthermore, exemplary embodiments of the present invention provide adual camera module minimized in total length of the dual camera module.Still furthermore, exemplary embodiments of the present inventionprovide an optical apparatus including the dual camera module.

Technical Solution

In one general aspect of the present invention, there is provided a dualcamera module, the dual camera module comprising:

a first camera module including a first lens module and a first imagesensor disposed below the first lens module; and

a second camera module including a second lens module and a second imagesensor disposed below the second lens module, wherein

the second camera module has a wider angle of view than the first cameramodule, and the second image sensor is disposed at a position higherthan the first image sensor.

Preferably, but not necessarily, the first camera module may furtherinclude a first housing accommodating, at an inside thereof, at least apart of the first lens module, and the second camera module may furtherinclude a second housing accommodating, at an inside thereof, at least apart of the second lens module at an inside, wherein

an upper end of the first housing may be disposed at a height of aposition corresponding to that of the second housing.

Preferably, but not necessarily, the first camera module may furtherinclude a first substrate coupled by the first image sensor, the secondcamera module may further include a second substrate coupled by thesecond image sensor, wherein

the second substrate is disposed at an upper surface of the firstsubstrate.

Preferably, but not necessarily, the first image sensor may be disposedat an upper surface of the first substrate, and the second image sensormay be disposed at an upper surface of the second substrate.

Preferably, but not necessarily, the first camera module may furtherinclude a first driving part coupled with the first lens module and asecond driving part spaced apart from the first driving part to move thefirst lens module through an electromagnetic interaction with the firstdriving part,

the second camera module may further include a third driving partcoupled with the second lens module and a fourth driving part spacedapart from the third driving part to move the second lens module throughan electromagnetic interaction with the third driving part, wherein

an upper end of the first lens module may be protruded further upwardthan an upper end of the first housing in response to movement of thefirst lens module.

Preferably, but not necessarily, the second substrate may be fixed to anupper surface of the first substrate through a non-conductive adhesive.

Preferably, but not necessarily, alignment between an optical axis ofthe first camera module and an optical axis of the second camera modulemay be adjusted by the adhesive.

Preferably, but not necessarily, the first housing may be disposed bybeing spaced apart from the second housing.

Preferably, but not necessarily, the second camera module may be shorterin EFL (Effective Focal Length) or TTL (Total Track Length) than thefirst camera module.

Preferably, but not necessarily, each thickness of the first substrateand the second substrate may be in the range of 0.4 mm-0.6 mm.

Preferably, but not necessarily, thickness of the adhesive may be in therange of 0.03 mm-0.5 mm.

Preferably, but not necessarily, the first camera module may furtherinclude a first substrate coupled by the first image sensor, and thesecond camera module may further include a second substrate coupled bythe second image sensor, wherein the thickness of the second substratemay be thicker than that of the first substrate.

Preferably, but not necessarily, the first substrate and the secondsubstrate may be integrally formed.

Preferably, but not necessarily, the second image sensor may be mountedat an upper surface of the second substrate, and the second image sensormay be mounted at a bottom surface of the first substrate by a flip chipmethod.

Preferably, but not necessarily, the first camera module may furtherinclude a third substrate coupled to the first substrate and extended toan outside, wherein the first substrate may include a cavityaccommodated by at least a part of the third substrate.

In another general aspect of the present invention, there is provided anoptical apparatus, the apparatus comprising: a cover member forming anexterior look, a display part disposed at the cover member and a dualcamera module accommodated into the cover member, wherein the dualcamera module includes:

a first camera module including a first lens module and a first imagesensor disposed below the first lens module; and

a second camera module including a second lens module and a second imagesensor disposed below the second lens module, wherein the second cameramodule has a wider angle of view than the first camera module, and thesecond image sensor is disposed at a position higher than the firstimage sensor.

Preferably, but not necessarily, a distance between the cover member andthe first image sensor may be longer than a distance between the covermember and the second image sensor.

Preferably, but not necessarily, the first camera module may furtherinclude a first housing accommodating, at an inside thereof, at least apart of the first lens module, and the second camera module may furtherinclude a second housing accommodating, at an inside thereof, at least apart of the second lens module at an inside, wherein

a distance between an upper end of the first housing and the covermember may correspond to a distance between an upper end of the secondhousing and the cover member.

Preferably, but not necessarily, the optical apparatus may furthercomprise a Poron contacting the cover member.

Preferably, but not necessarily, the optical apparatus may furthercomprise:

a first window part so formed as to pass through the cover member anddisposed at an upper side of the first lens module; and

a second window part so formed as to pass through the cover member anddisposed at an upper side of the second lens module, wherein

the second window part may have a broader area than the first windowpart.

In still another general aspect of the present invention, there isprovided with a dual camera module, the dual camera module comprising:

a first camera module;

a second camera module having a wider angle of view than the firstcamera module;

a first substrate mounted at an upper surface with an image sensor ofthe first camera module;

a second substrate mounted at an upper surface with an image sensor ofthe second camera module, wherein the second substrate may be disposedat an upper surface of the first substrate.

Preferably, but not necessarily, height of an upper end of a housing atthe first camera module may correspond to height of an upper end of ahousing at the second camera module.

Preferably, but not necessarily, the first camera module may include alens module disposed at an inner space of the housing, wherein the lensmodule moves to a vertical direction which is an optical axis directionin order to perform an auto focusing function, and an upper end of thelens module may farther protrude than an upper end of the housing inresponse to movement of the lens module.

Preferably, but not necessarily, the second substrate may be fixed toone surface of the first substrate through a non-conductive adhesive.

Preferably, but not necessarily, alignment between an optical axis ofthe first camera module and an optical axis of the second camera modulemay be adjusted by the adhesive.

Preferably, but not necessarily, the first camera module may be disposedby being spaced apart from the second camera module.

Preferably, but not necessarily, the second camera module may be shorterin EFL (Effective Focal Length) or TTL (Total Track Length) than thefirst camera module.

Preferably, but not necessarily, each vertical direction thickness ofthe first substrate and the second substrate may be in the range of 0.4mm-0.6 mm.

Preferably, but not necessarily, vertical direction thickness of theadhesive may be in the range of 0.03 mm-0.5 mm.

In another general aspect of present invention, there is provided withan optical apparatus, the optical apparatus comprising:

a main body;

a display part arranged at one surface of the main body to displayinformation; and

a dual camera module disposed at the main body to photograph an image ora photograph, wherein

the dual camera module includes:

a first camera module;

a second camera module having a wider angle of view than the firstcamera module;

a first substrate mounted at an upper surface with an image sensor ofthe first camera module;

a second substrate mounted at an upper surface with an image sensor ofthe second camera module, wherein the second substrate may be disposedat an upper surface of the first substrate.

Preferably, but not necessarily, the optical apparatus may furthercomprise a cover member disposed at an upper side of the first cameramodule and at an upper side of the second camera module, and a distancebetween the second substrate and the cover member may be shorter than adistance between the first substrate and the cover member.

Preferably, but not necessarily, a distance between an upper end of ahousing at the first camera module and the cover member may correspondto a distance between an upper end of a housing at the second cameramodule and the cover member.

Preferably, but not necessarily, the first camera module may include alens module disposed at an inner space of a housing at the first cameramodule, wherein the lens module may move to a vertical direction whichis an optical axis direction in order to perform an auto focus function,and an upper end of the lens module may be further protrude than anupper end of the housing in response to movement of the lens module.

Preferably, but not necessarily, a connection member may be disposedbetween the first housing and the cover member in order to fix the firsthousing to the cover member.

Preferably, but not necessarily, the connection member may include aPoron.

Preferably, but not necessarily, the optical apparatus may furthercomprise:

a first window part disposed at the cover member to allow a transmittedlight to proceed to the first camera module; and

a second window part disposed at the cover member to allow a transmittedlight to proceed to the second camera module, wherein

the second window part may have a broader area than the first windowpart in order to obtain a wider angle of view than the first windowpart.

In still further general aspect of the present invention, there isprovided a dual camera module, the dual camera module comprising:

a first camera module;

a second camera module having a wider angle of view than the firstcamera module;

a substrate mounted with a first image sensor of the first camera moduleand a second image sensor of the second camera module; wherein

thickness of the substrate may be such that a part mounted with thefirst image sensor may be thinner than a portion mounted with the secondimage sensor.

Preferably, but not necessarily, height of an upper end of a housing atthe first camera module may correspond to height of an upper end of ahousing at the second camera module.

Preferably, but not necessarily, the substrate may include a firstcircuit layer, a second circuit layer disposed at an upper side of thefirst substrate layer, wherein the first image sensor may be mounted onthe first circuit layer, and the second image sensor may be mounted onthe second image sensor.

Preferably, but not necessarily, each thickness of the first circuitlayer and the second circuit layer may be in the range of 0.2 mm-0.3 mm.

Preferably, but not necessarily, the second circuit layer may be omittedat a portion corresponding to a portion where the first image sensor ismounted on the first circuit layer.

Preferably, but not necessarily, the second image sensor may be mountedat an upper surface of the substrate, and the first image sensor may bemounted at a bottom surface of the substrate in a flip-flop method.

Preferably, but not necessarily, the first camera module may include alens module disposed at an inner space of a housing, wherein the lensmodule may move to a vertical direction which is an optical axisdirection in order to perform an auto focus function, and an upper endof the lens module may be further protrude than an upper end of thehousing in response to movement of the lens module.

Preferably, but not necessarily, the first camera module and the secondcamera module may be disposed by being spaced apart.

Preferably, but not necessarily, the second camera module may be shorterin EFL (Effective Focal Length) or TTL (Total Track Length) than thefirst camera module.

In still another general aspect of present invention, there is providedwith an optical apparatus, the optical apparatus comprising:

a main body;

a display part arranged at one surface of the main body to displayinformation; and

a dual camera module disposed at the main body to photograph an image ora photograph, wherein

the dual camera module includes:

a first camera module;

a second camera module having a wider angle of view than the firstcamera module;

a substrate mounted with a first image sensor of the first camera moduleand a second image sensor of the second camera module, wherein the firstimage sensor may be disposed at a farther bottom side than the secondimage sensor.

Preferably, but not necessarily, the optical apparatus may furthercomprise: a cover member disposed at an upper side of the first cameramodule and at an upper side of the second camera module, wherein adistance between the first image sensor and the cover member maycorrespond to a distance between an upper end of the housing at thesecond camera module and the cover member.

Preferably, but not necessarily, the first camera module may include alens module disposed at an inner space of the housing at the firstcamera module, wherein the lens module may move to a vertical directionwhich is an optical axis direction in order to perform an auto focusfunction, and an upper end of the lens module may be further protrudethan an upper end of the housing in response to movement of the lensmodule.

Preferably, but not necessarily, a connection member may be disposedbetween the first housing and the cover member in order to fix the firsthousing to the cover member.

Preferably, but not necessarily, the connection member may include aPoron.

Preferably, but not necessarily, the optical apparatus may furthercomprise:

a first window part disposed at the cover member to allow a transmittedlight to proceed to the first camera module; and

a second window part disposed at the cover member to allow a transmittedlight to proceed to the second camera module, wherein

the second window may have a broader area than the first window part inorder to obtain a wider angle of view than the first window part.

In still further general aspect of the present invention, there isprovided a dual camera module, the dual camera module comprising:

a first camera module;

a second camera module having a wider angle of view than the firstcamera module;

a first substrate mounted at an upper surface of an image sensor of thefirst camera module;

a second substrate mounted at an upper surface of an image sensor of thesecond camera module and disposed at an upper surface of the firstsubstrate; and

a third substrate electrically connected to the first substrate, whereinthe first substrate may include a cavity accommodating at least aportion of the third substrate.

Preferably, but not necessarily, the third substrate may include acoupling part accommodated into the cavity, wherein the coupling partmay be coupled to the first substrate using an ACF (AnistropicConductive Film).

Preferably, but not necessarily, the first substrate may have rigidity,and the third substrate may have flexibility.

Preferably, but not necessarily, the first substrate may include aceramic PCB (Printed Circuit Board).

Preferably, but not necessarily, the first substrate, the secondsubstrate and the third substrate may be overlapped at least at aportion thereof toward a vertical direction.

Preferably, but not necessarily, the second substrate may be fixed to anupper surface of the first substrate through a non-conductive adhesive.

Preferably, but not necessarily, an alignment between an optical axis ofthe first camera module and an optical axis of the second camera modulemay be adjusted in the process of the second substrate being adhered tothe first substrate using the adhesive.

Preferably, but not necessarily, at least a portion of the thirdsubstrate may be disposed between the adhesive and the first substrate.

Preferably, but not necessarily, the cavity may be disposed at an uppersurface of the first substrate.

Preferably, but not necessarily, the cavity may be disposed at a bottomsurface of the first substrate.

Preferably, but not necessarily, the dual camera module may furthercomprise a fourth substrate electrically connected to the secondsubstrate, and the second substrate and the fourth substrate may beformed by a Rigid Flexible PCB.

Preferably, but not necessarily, the first camera module may include alens module disposed at an inner space of the housing, wherein the lensmodule may move to a vertical direction which is an optical axisdirection for performing an auto focusing function, and an upper end ofthe lens module may be farther protruded than an upper end of thehousing in response to movement of the lens module.

Preferably, but not necessarily, the first camera module and the secondcamera module may be disposed by being spaced apart.

Preferably, but not necessarily, the second camera module may be shorterin EFL (Effective Focal Length) or TTL (Total Track Length) than thefirst camera module.

Preferably, but not necessarily, each vertical thickness of the firstsubstrate and the second substrate may be in the range of 0.4 mm-0.6 mm.

Preferably, but not necessarily, a vertical thickness of the cavity maybe in the range of 0.2 mm-0.3 mm.

In still further general aspect of the present invention, there isprovided an optical apparatus, the optical apparatus comprising:

a main body;

a display part arranged at one surface of the main body to displayinformation; and

a dual camera module disposed at the main body to photograph an image ora photograph, wherein

the dual camera module includes:

a first camera module;

a second camera module having a wider angle of view than the firstcamera module;

a first substrate mounted at an upper surface with an image sensor ofthe first camera module;

-   -   a second substrate mounted at an upper surface with an image        sensor of the second camera module; and

a third substrate electrically connected to the first substrate, wherein

the first substrate includes a cavity accommodated with at least aportion of the third substrate.

Advantageous Effects of the Invention

The exemplary embodiments are advantageous in the aspect of designbecause an inner structural exposure of wide angle camera module isminimized. Furthermore, The exemplary embodiments are advantageous inthat attachment of Poron is made easy that performs foreign objectinfuse prevention function and camera module fixing function relative toa cover member.

Furthermore, a reduced total length of dual camera module can beprovided to miniaturize an optical apparatus.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1 and 2 are conceptual view illustrating a dual camera moduleaccording to an exemplary embodiment of the present invention.

FIGS. 3A and 3B are schematic diagrams illustrating a dual camera moduleaccording to an exemplary embodiment of the present invention.

FIGS. 4 and 5 are conceptual views illustrating a dual camera moduleaccording to a modification of another exemplary embodiment of thepresent invention.

FIG. 6 is a conceptual view illustrating a dual camera module accordingto a modification of another exemplary embodiment of the presentinvention.

FIGS. 7 and 8 are conceptual views illustrating a dual camera moduleaccording to a modification of still another exemplary embodiment of thepresent invention.

BEST MODE

Some of the exemplary embodiments of the present invention will bedescribed with the accompanying drawings. Detailed descriptions ofwell-known functions, configurations or constructions are omitted forbrevity and clarity so as not to obscure the description of the presentdisclosure with unnecessary detail. Furthermore, throughout thedescriptions, the same reference numerals will be assigned to the sameelements in the explanations of the figures.

Furthermore, the terms “first,” “second,” “A”, “B”, (a), (b) and thelike, herein do not denote any order, quantity, or importance, butrather are used to distinguish one element from another. In thefollowing description and/or claims, the terms coupled and/or connected,along with their derivatives, may be used. In particular embodiments,connected may be used to indicate that two or more elements are indirect physical and/or electrical contact with each other. Coupled maymean that two or more elements are in direct physical and/or electricalcontact. However, coupled may also mean that two or more elements maynot be in direct contact with each other, but yet may still cooperateand/or interact with each other. For example, “coupled”, and “connected”may mean that two or more elements do not contact each other but areindirectly joined together via another element or intermediate elements.

An “optical axis direction” as used hereinafter is defined as an opticalaxis direction of a lens module in a state of being coupled to a lensdriving unit. Meantime, the “optical axis direction” may beinterchangeably used with a vertical direction and z axis direction.

An “auto focus function” as used hereinafter is defined as a function ofmatching a focus relative to an object by adjusting a distance from animage sensor by moving to an optical axis direction a lens module inresponse to a distance to the object in order to obtain a clear image ofthe object on the image sensor. Meantime, the “auto focus” may beinterchangeably used with “AF”.

A “handshake correction function” as used hereinafter is defined as afunction of moving or tilting a lens module to a direction perpendicularto an optical axis direction in order to offset vibration (movement)generated on the image sensor by an external force. Meantime, the“handshake correction” may be interchangeably used with an “OIS (OpticalImage Stabilization)”.

Now, a configuration of an optical apparatus according to an exemplaryembodiment of the present invention will be described hereinafter.

The optical apparatus according to an exemplary embodiment of thepresent invention may be a hand phone, a mobile phone, a smart phone, aportable smart device, a digital camera, a notebook computer (laptopcomputer), a PMP (Portable Multimedia Player) and a navigation device.However, the present invention is not limited thereto, and may includeany device capable of photographing an image or a photograph.

The optical apparatus according to an exemplary embodiment of thepresent invention may include a main body(not shown), a display part(not shown) arranged at one surface of the main body to displayinformation, and a camera having a dual camera module (not shown)disposed at the main body to photograph an image or a photograph.

Hereinafter, configuration of dual camera module according to anexemplary embodiment of the present invention will be described.

FIGS. 1 and 2 are conceptual view illustrating a dual camera moduleaccording to an exemplary embodiment of the present invention.

Referring to FIGS. 1 and 2, the dual camera module according to anexemplary embodiment of the present invention may include a first cameramodule (100) and a second camera module (200). Meantime, the dual cameramodule according to an exemplary embodiment of the present invention mayfurther include a first cover member (500) to cover the first cameramodule (100). Furthermore, the dual camera module according to anexemplary embodiment of the present invention may further include asecond cover member (600) to cover the second camera module (200).

In addition, the dual camera module according to an exemplary embodimentof the present invention may further include a first substrate (300)mounted with a first image sensor (110) of the first camera module(100). Furthermore, the dual camera module according to an exemplaryembodiment of the present invention may further include a secondsubstrate (300) mounted with a second image sensor (210) of the secondcamera module (200).

Here, the first cover member (500) and the first substrate (300) may beformed by using the first camera module (100), and may be also formed bya member separate from the first camera module (100). Furthermore, asecond cover member (600) and the second substrate (400) may be formedby using the second camera module (200), and may be also formed by amember separate from the second camera module (200). Hereinafter,although the first cover member (500) and the second cover member (600)are described as separate members, the first cover member (500) and thesecond cover member (600) may be one configuration by being integrallyformed.

The first camera module (100) may be a narrow angle camera module. Inother words, the first camera module (100) may be narrower in view anglethan the second camera module (200). That is, a view angle (01) of thefirst camera module (100) may be narrower than a view angle (02) of thesecond camera module (200). An EFL (Effective Focal Length, B1) of thefirst camera module (100) may be longer than an EFL (B2) of the secondcamera module (200). Furthermore, a TTL (Total Track Length, C1) of thefirst camera module (100) may be longer than a TTL (C2) of the secondcamera module (200).

The first camera module (100) may include a first image sensor (110), afirst housing (120), a first inner side space (130) and a first lensmodule (140).

The first image sensor (110) may obtain a light incident through a firstlens module (140) of the first camera module (100). The first imagesensor (110) may be mounted on the first substrate (300). The firstimage sensor (110) may be disposed to match with the first lens module(140) at the optical axis, whereby the first image sensor (110) canoutput as an image by obtaining a light having passed the first lensmodule (140). The first image sensor (110), may be a CCD (Charge CoupledDevice), a MOS (Metal Oxide Semiconductor), a CPD or a CID, for example.However, the present invention is not limited to the given types ofimage sensor and may include other types of image sensors.

A first housing (120) may be disposed between the first substrate (300)and the first cover member (500). The first housing (120) may formtherein a first inner side space (130) to accommodate the first lensmodule (140). The first inner side space (130) may be interposed betweenthe first substrate (300) and the first cover member (500). The firstinner side space (130) may be disposed with the first lens module (140).The first inner side space (130) may be formed to obtain a moving space(D) of the first lens module (140) in order to perform the AF (AutoFocus) function. The moving space (D) may be formed by a connector (700)disposed between the first cover member (500) and the first housing(120).

The first lens module (140) may be disposed at the first inner sidespace (130). The first lens module (140) may move to an optical axisdirection (A, vertical direction) in order to perform the AF function.At this time, the movement of the first lens module (140) may beperformed by the electromagnetic interaction.

For example, the movement control of the first lens module (140) may beimplemented through a power application control to a coil by allowingthe first lens module (140) to be disposed with a magnet (not shown),and the first housing (120) to be disposed with the coil (not shown).Furthermore, the first lens module (140) may be disposed with the coiland the first housing (120) may be disposed with a magnet. The opticalaxis of the first lens module (140) may match an optical axis of thefirst image sensor (110). The optical axis of the first lens module(140) may be parallel with an optical axis of a second lens module(240).

The first lens module (140) may move to a vertical direction which is anoptical axis direction in order to perform the AF function. Furthermore,an upper end of the first lens module (140) may farther protrude over anupper end of the first housing (120) in response to the movement of thefirst lens module (140). Furthermore, the first lens module (140) mayfarther protrude over an upper end of the first housing (120) in aninitial state where no current is supplied to the first camera module(100). In an example of the present invention, a connection part (700)may be interposed between the cover members (500, 600) and the firsthousing (120) in order to secure a moving space of the first lens module(140). That is, the connector (700) may expand a movable space of thefirst lens module (140).

The second camera module (200) may be a wide angle camera module. Thesecond camera module (200) may be a wide angle camera module. In otherwords, the second camera module (200) may be wider in view angle thanthe first camera module (100). That is, a view angle (02) of the secondcamera module (200) may be wider than a view angle (01) of the firstcamera module (100). An EFL (Effective Focal Length, B2) of the secondcamera module (200) may be shorter than an EFL (B1) of the first cameramodule (100). Furthermore, a TTL (Total Track Length, C2) of the secondcamera module (200) may be shorter than a TTL (C1) of the first cameramodule (100).

The second camera module (200) may be arranged in parallel with thefirst camera module (100). An optical axis of the second camera module(200) may be aligned with an optical axis of the first camera module(100). The optical axis of the second camera module (200) may be inparallel with the optical axis of the first camera module (100). Thesecond camera module (200) may be spaced apart from the first cameramodule (100). Furthermore, the second camera module (200) may be sodisposed as to abut the first camera module (100).

The second camera module (200) may include a second image sensor (210),a second housing (220), a second inner side space (230) and a secondlens module (240).

The second image sensor (210) may obtain a light incident through asecond lens module (240) of the second camera module (200). The secondimage sensor (210) may be mounted on the second substrate (400). Thesecond image sensor (210) may be disposed to match with the second lensmodule (240) at the optical axis, whereby the second image sensor (210)can output as an image by obtaining a light having passed the secondlens module (240). The second image sensor (210) may be a CCD (ChargeCoupled Device), a MOS (Metal Oxide Semiconductor), a CPD or a CID, forexample. However, the present invention is not limited to the giventypes of image sensors and may include other types of image sensors.

The second housing (220) may be disposed between the second substrate(400) and the second cover member (600). The second housing (220) mayform therein a second inner side space (230) to accommodate the secondlens module (240). The second inner side space (230) may be formedinside of the second housing (220).

The inner side space (230) may be disposed between the second substrate(400) and the second cover member (600). The second inner side space(230) may be disposed with the second lens module (240). The secondinner side space (230) may be formed with a moving space of the secondlens module (240) in order to perform the AF function.

The second lens module (240) may be disposed at the second inner sidespace (230). The second lens module (240) may move to an optical axisdirection (vertical direction) in order to perform the AF function. Atthis time, the movement of the second lens module (240) may beimplemented by electromagnetic interaction. For example, the movementcontrol of the second lens module (240) may be implemented by powerapplication control relative to the coil while the second lens module(240) is disposed with a magnet (not shown), and the second housing(220) is disposed with a coil (not shown). Furthermore, the second lensmodule (240) may be disposed with a coil and the second housing (220)may be disposed with a magnet. The optical axis of the second lensmodule (240) may match to that of the second image sensor (210). Theoptical axis of the second lens module (240) may be in parallel withthat of the first lens module (140).

The first substrate (300) may be mounted with the first image sensor(110) of the first camera module (100). That is, the first substrate(300) may transmit an image to an outside by outputting the imageobtained through the first image sensor (110). An upper surface (310) ofthe first substrate (300) may be mounted with the first image sensor(110). The upper surface (310) of the first substrate (300) may bemounted with a second substrate (400). Through this configuration, thesecond image sensor (210) of the second substrate (400) may be disposedhigher than the first image sensor (110) mounted on the first substrate(300). That is, the second image sensor (210) may be disposed closer tothe cover members (500, 600) than the first image sensor (110).

The first substrate (300) may supply a power to the first camera module(100). Meantime, the first substrate (300) may be disposed with a firstcontroller (not shown) in order to control the first camera module(100). The first controller may be mounted on the first substrate (300).Meantime, the first controller may control a direction, intensity andamplitude of current supplied to each component forming the first cameramodule (100). The first controller may perform at least one of the AFfunction and a handshake correction function of the camera module bycontrolling the first camera module (100). That is, the first controllermay move the lens module to an optical axis direction or to a directionperpendicular to the optical axis direction or tilt the lens module bycontrolling the first camera module (100). Furthermore, the firstcontroller may perform a feedback control of AF function and handshakecorrection function relative to the first camera module (100).

An adhesive (350) may be interposed between the first substrate (300)and the second substrate (400). At this time, the adhesive (350) may beformed with a non-conductive material. Thus, each of the first substrate(300) and the second substrate (400) may be separately connected to anoutside power surface. However, the adhesive (350) may be a conductivematerial. Each of the first substrate (300) and the second substrate(400) may have a vertical thickness of 0.4-0.6 mm. Furthermore, thefirst substrate (300) and the second substrate (400) may be bonded usingan adhesive (350) formed with epoxy, where the thickness of epoxy may be0.03-0.5 mm.

The adhesive (350) may fix the first substrate (300) to the secondsubstrate (400). The second substrate (400) may be such that an opticalaxis alignment with the first substrate (300) can be adjusted in thecourse of adhering the first substrate (300) using the adhesive (350).That is, an alignment between an optical axis of the first camera module(100) and an optical axis of the second camera module (200) may beadjusted by the adhesive (350). For example, the second substrate (400)may be movably adhered to the first substrate (300) using an initiallyhardened adhesive (350) where the optical axis may be aligned and thesecond substrate (400) may be fixed by using a finally hardened adhesive(350). The adhesive (350) may be a non-conductive material, for example.That is, the first substrate (300) and the second substrate (400) maynot be electrically conductive.

The second substrate (400) may be mounted with the second image sensor(210) of the second camera module (200). That is, the second substrate(400) may transmit an image obtained through the second image sensor(210) to an outside. The second substrate (400) may be mounted at anupper surface with the second image sensor (210). The second substrate(400) may be adhered at a bottom surface to the upper surface (310).Through this configuration, the second image sensor (410) mounted on thesecond substrate (400) may be more closely positioned to the covermember (500,600) than the first image sensor (110) mounted on the firstsubstrate (300).

The second substrate (400) may supply a power to the second cameramodule (200). Meantime, the second substrate (400) may be disposed witha second controller (not shown) in order to control the second cameramodule (200). The second controller may be mounted on the secondsubstrate (400). Meantime, the second controller may be disposed at aninner side of the second housing (220).

The second controller may control a direction, intensity and amplitudeof current supplied to each component forming the second camera module(200). The second controller may perform at least one of the AF functionand a handshake correction function of the camera module by controllingthe second camera module (200). That is, the second controller may movethe lens module to an optical axis direction or to a directionperpendicular to the optical axis direction or tilt the lens module bycontrolling the second camera module (200). Furthermore, the secondcontroller may perform a feedback control of AF function and handshakecorrection function relative to the second camera module (200).

The first cover member (500) may be disposed at an upper side of thefirst camera module (100). The first cover member (500) may protect thefirst camera module (100) from outside. Meanwhile, the first covermember (500) may form an external look of the dual camera module. Thefirst cover member (500) may be disposed with a first window part (510).

The first window part (510) may be disposed with a first cover member(500). The first window part (510) may have a narrower area than asecond window part (610). This is for the first window part (510) toobtain a narrower view angle than the second window part (610). Thefirst window part (510) may be formed with a material capable oftransmitting a light. That is, a light having passed the first windowpart (510) may be obtained by the first image sensor (110) through thefirst lens module (140).

The second cover member (600) may be disposed at an upper side of thesecond camera module (200). The second cover member (600) may protectthe second camera module (200) from the outside. Meantime, the secondcover member (600) may form an external look of the dual camera module.The second cover member (600) may be formed to have a same height asthat of the first cover member (500). The first cover member (500) andthe second cover member (600) may be integrally formed. The first covermember (500) may be disposed with the first window part (510). Thesecond cover member (600) may be disposed with the second window part(610). The first cover member (500) and the second cover member (600)may form a main body of the optical apparatus. That is, the first covermember (500) and the second cover member (600) may form an external lookof the optical apparatus.

The second window part (610) may be disposed at the second cover member(600). The second window part (610) may have a broader area than thefirst window part (510). That is, a width (w2) of the second window part(610) may be longer than a width (w1) of the first window part (510).The second window part (610) may have a broader area than the firstwindow part (510). This is for the second window part (610) to obtain awider view angle than the first window part (510). The second windowpart (610) may be formed with a material capable of transmitting alight. That is, a light having passed the second window part (610) maybe obtained by the second image sensor (210) through the second lensmodule (240).

Although the foregoing description has explained the present inventionby dividing the first cover member (500) and the second cover member(600), the first cover member (500) and the second cover member (600)may be integrally formed. In this case, the first cover member (500) andthe second cover member (600) may be called as cover member (500, 600).Meantime, although the cover member (500, 600) has been explained as oneconfiguration of the dual camera module, the cover member (500, 600) maybe separately configured. For example, the cover member (500, 600) mayform an external look of the optical apparatus as one configuration.

The dual camera module according to an exemplary embodiment of thepresent invention may further comprise a camera module (100, 200) and aconnector (700) connecting the cover members (500, 600).

The connector (700) may be interposed between the housing (120, 220) ofthe camera module (100, 200) and the cover member (500, 600). Theconnector (700) may fix the housing (120, 220) to the cover member (500,600). Meantime, the connector (700) may fix cover member (500, 600) tothe housing (120, 220). The connector (700) may be Poron, for example.In this case, the connector (700) formed with the Poron may not onlyprovide a fixing power to the housing (120, 220) and to the cover member(500, 600) but also perform a light shield effect, a cushioning effectand a foreign object prevention effect. The connector (700) may includea first connector (710) and a second connector (720).

The first connector (710) may be interposed between the first housing(120) and the first cover member (500). The first connector (710) mayfix the first housing (120) to the first cover member (500). Meantime,the first connector (710) may fix the first cover member (500) to thefirst housing (120).

The second connector (720) may be interposed between the second housing(220) and the second cover member (600). The second connector (720) mayfix the second housing (220) to the second cover member (600). Meantime,the second connector (720) may fix the second cover member (600) to thesecond housing (220).

FIGS. 3A and 3B are schematic diagrams illustrating a dual camera moduleaccording to an exemplary embodiment of the present invention.

The first camera module (100) may include a first driving part (810)coupled to the first lens module (140). The first driving part (810) maybe coupled to the first lens module (140). The first driving part (810)may be coupled to an outside surface of a bobbin (not shown) coupled tothe first lens module (140). The first driving part (810) may include asecond driving part (820) facing the first driving part (810). Thesecond driving part (820) may face the first driving part (810). Thesecond driving part (820) may electromagnetically interact with thefirst driving part (810).

The second driving part (820) may move the first lens module (140)through the electromagnetic interaction with the first driving part(810). The second driving part (820) may be spaced apart from the firstdriving part (810). The second driving part (820) may be coupled to thefirst housing (120). The first driving part (810) may include a coil,and the second driving part (820) may include a magnet. Alternatively,the second driving part (820) may include a coil and the first drivingpart (810) may include a magnet.

The second camera module (200) may include a third driving part (830)coupled to the second lens module (240). The third driving part (830)may be coupled to the second lens module (240). The third driving part(830) may be coupled to an outside surface of a bobbin (not shown)coupled to the second lens module (240). The second camera module (200)may include a fourth driving part (840) facing the third driving part(830). The fourth driving part (840) may face the third driving part(830). The fourth driving part (840) may electromagnetically interactwith the third driving part (830).

The fourth driving part (840) may move the second lens module (240)through the electromagnetic interaction with the third driving part(830). The fourth driving part (840) may be spaced apart from the thirddriving part (830). The fourth driving part (840) may be coupled to thesecond housing (220). The third driving part (830) may include a coil,and the fourth driving part (840) may include a magnet. Alternatively,the fourth driving part (840) may include a coil and the third drivingpart (830) may include a magnet.

Hereinafter, operation and effect of dual camera module according to anexemplary embodiment of the present invention will be described.

FIGS. 1 and 2 are conceptual view illustrating a dual camera moduleaccording to an exemplary embodiment of the present invention.

The first camera module (100) may be called as a narrow angle cameramodule (100) because of having a narrower view angle than the secondcamera module (200), and then second camera module (200) may be calledas wide angle camera module (200) because of having a wider view anglethan the first camera module (100). The lens module (140) of the narrowangle camera module (100) may function as a telephoto lens, and the lensmodule (240) of wide angle camera module (200) may function as a wideangle lens.

First of all, the dual camera module can function while an optical axisof the first camera module (100) and an optical axis of the secondcamera module (200) are aligned. The dual camera module according to anexemplary embodiment of the present invention may output an imageobtained by the second camera module (200) when a user photographs anobject of a short distance, and output an image obtained by the firstcamera module (100) when a user photographs an object of a longdistance. Furthermore, the dual camera module according to an exemplaryembodiment of the present invention may output an image obtained by thefirst camera module (100) and an image obtained by the second cameramodule (200), based on the distance of an object, by combining the imageobtained by the first camera module (100) and the image obtained by thesecond camera module (200).

That is, the dual camera module according to an exemplary embodiment ofthe present invention may obtain objects positioned in a long distanceor a close distance as images of clear quality. In other words, the dualcamera module (100) according to an exemplary embodiment of the presentinvention can provide a corresponding function as that of a zoom lenseven without an zoom lens.

Furthermore, the first image sensor (110) of the first camera module(100) is mounted on the first substrate (300) and the second imagesensor (210) of the second camera module (200) is mounted on the secondsubstrate (400) in the dual camera module according to an exemplaryembodiment of the present invention, where the second substrate (400) isadhered to an upper surface of the first substrate (300), and as aresult, the first image sensor (110) can be positioned closer to thecover member (500, 600) than the second image sensor (210).

In this case, a width (w2) of the second window part (610) that mustobtain a view angle, which is a wide angle of the second camera module(200), may become relatively wider {compared with a case where thesecond images sensor (110) is mounted on the first substrate (300)}.That is, an area of the second window part (610) may be increased,whereby a phenomenon of an inner configuration of the second cameramodule (200) being exposed through the second window part (610) can beinhibited.

Furthermore, when the first substrate (300) is mounted with the secondimage sensor (210), a height of the second housing (220) may becomelowered to require a separate additional member for fixing the Poronbetween the second housing (220) and the second cover member (600).However, in the dual camera module according to an exemplary embodimentof the present invention, a height at an upper end of the second housing(200) can be increased compared to the previous comparative example toadvantageously fix the Poron without a separate additional memberbetween the second housing (220) and the second cover member (600).

Hereinafter, an optical apparatus according to another exemplaryembodiment of the present invention will be described.

The optical apparatus according to another exemplary embodiment of thepresent invention may be a hand phone, a mobile phone, a smart phone, aportable smart device, a digital camera, a notebook computer (laptopcomputer), a PMP (Portable Multimedia Player) and a navigation device.However, the present invention is not limited thereto, and may includeany device capable of photographing an image or a photograph.

The optical apparatus according to another exemplary embodiment of thepresent invention may include a main body, a display part arranged atone surface of the main body to display information, and a camera havinga dual camera module (not shown) disposed at the main body to photographan image or a photograph.

Hereinafter, configuration of a dual camera module according to anotherexemplary embodiment of the present invention will be described withreference to the drawings.

FIGS. 4 and 5 are conceptual views illustrating a dual camera moduleaccording to a modification of another exemplary embodiment of thepresent invention.

Referring to FIGS. 4 and 5, a dual camera module according to amodification of another exemplary embodiment of the present inventionmay include a first camera module (1100) and a second camera module(1200). Meantime, the dual camera module according to a modification ofanother exemplary embodiment of the present invention may furtherinclude a first cover member (1500) to cover the first camera module(1100).

The dual camera module according to a modification of another exemplaryembodiment of the present invention may further include a second covermember (1600) to cover the second camera module (1100). Furthermore, thedual camera module according to a modification of another exemplaryembodiment of the present invention may further include a substrate(1300) mounted with a first image sensor (1110) of the first cameramodule (1100), and a second image sensor (1210) of the second cameramodule (1200). Here, the first cover member (1500) and the substrate(1300) may be formed as one of configurations of the first camera module(1100), and may be formed as a member separate from the first cameramodule (1100). Furthermore, the second cover member (1600) and thesubstrate (1300) may be formed as one of configurations of the secondcamera module (1200), and may be formed as a member separate from thesecond camera module (1200).

The first camera module (1100) may be a narrow angle camera module. Inother words, the first camera module (1100) may be narrower in viewangle than the second camera module (1200). That is, a view angle (011)of the first camera module (1100) may be narrower than a view angle(021) of the second camera module (1200). An EFL (Effective FocalLength, B11) of the first camera module (1100) may be longer than an EFL(B21) of the second camera module (1200). Furthermore, a TTL (TotalTrack Length, C11) of the first camera module (1100) may be longer thana TTL (C21) of the second camera module (1200).

The first image sensor (1110) may obtain a light incident through thefirst lens module (1140) of the first camera module (1100). The firstimage sensor (1110) may be mounted on the substrate (1300). To be morespecific, the first image sensor (1110) may be mounted on a firstcircuit layer (1310) of the substrate (1300). The first image sensor(1110) may be so disposed as to allow the first lens module (1140) tomatch an optical axis, through which the first image sensor (1110) mayoutput a light having passed the first lens module (1140) and output thelight as an image.

The first image sensor (1110) may be a CCD (Charge Coupled Device), aMOS (Metal Oxide Semiconductor), a CPD or a CID, for example. However,the present invention is not limited to the given types of image sensorand may include other types of image sensors.

A first housing (1120) may be disposed between the substrate (1300) andthe first cover member (1500). The first housing (1120) may form thereina first inner side space (1130) to accommodate the first lens module(1140). The first inner side space (1130) may be formed at an inside ofthe first housing (1120). The first inner side space (1130) may beinterposed between the substrate (1300) and the first cover member(1500). The first inner side space (1130) may be disposed with the firstlens module (1140).

The first inner side space (1130) may be so formed as to obtain a movingspace (D1) of the first lens module (1140) in order to perform the AF(Auto Focus) function. The moving space (D1) of the first lens module(1140) may be formed by a connection part (1700) disposed between thefirst cover member (1500) and the first housing (1120).

The first lens module (1140) may be disposed at the first inner sidespace (1130). The first lens module (1140) may move to an optical axisdirection (A1, vertical direction) in order to perform the AF function.At this time, the movement of the first lens module (1140) may beperformed by the electromagnetic interaction.

For example, the movement control of the first lens module (1140) may beimplemented through a power application control to a coil by allowingthe first lens module (1140) to be disposed with a magnet (not shown),and the first housing (1120) to be disposed with the coil (not shown).Furthermore, the first lens module (1140) may be disposed with the coiland the first housing (1120) may be disposed with a magnet. The opticalaxis of the first lens module (1140) may match an optical axis of thefirst image sensor (1110). The optical axis of the first lens module(1140) may be parallel with an optical axis of a second lens module(1240).

The first lens module (1140) may move to a vertical direction, which isan optical axis direction, in order to perform the AF function.Furthermore, an upper end of the first lens module (1140) may fartherprotrude over an upper end of the first housing (1120) in response tothe movement of the first lens module (1140). Furthermore, the firstlens module (1140) may farther protrude over an upper end of the firsthousing (1120) in an initial state where no current is supplied to thefirst camera module (1100). In an example of the present invention, aconnection part (1700) may be interposed between the cover members(1500, 1600) and the first housing (1120) in order to secure a movingspace of the first lens module (1140). That is, the connection part(1700) may expand a movable space of the first lens module (1140).

The second camera module (1200) may be a wide angle camera module. Inother words, the second camera module (1200) may be wider in view anglethan the first camera module (1100). That is, a view angle (021) of thesecond camera module (1200) may be wider than a view angle (011) of thefirst camera module (1100). An EFL (Effective Focal Length, B21) of thesecond camera module (1200) may be shorter than an EFL (B11) of thefirst camera module (1100). Furthermore, a TTL (Total Track Length, C21)of the second camera module (1200) may be shorter than a TTL (C11) ofthe first camera module (1100).

The second camera module (1200) may be arranged in parallel with thefirst camera module (1100). An optical axis of the second camera module(1200) may be aligned with an optical axis of the first camera module(1100). The optical axis of the second camera module (1200) may be inparallel with the optical axis of the first camera module (1100). Thesecond camera module (1200) may be spaced apart from the first cameramodule (1100). Furthermore, the second camera module (1200) may be sodisposed as to abut the first camera module (1100).

The second camera module (1200) may include a second image sensor(1210), a second housing (1220), a second inner side space (1230) and asecond lens module (1240).

The second image sensor (1210) may obtain a light incident through asecond lens module (1240) of the second camera module (1200). The secondimage sensor (1210) may be mounted on the substrate (1300). To be morespecific, the second image sensor (1210) may be mounted on a secondcircuit layer (1320) of the substrate (1300). The second image sensor(1210) may be disposed to match with the second lens module (1240) atthe optical axis, whereby the second image sensor (1210) can output alight as an image by obtaining the light having passed the second lensmodule (1240). The second image sensor (1210) may be a CCD (ChargeCoupled Device), a MOS (Metal Oxide Semiconductor), a CPD or a CID, forexample. However, the present invention is not limited to the giventypes of image sensors and may include other types of image sensors.

The second image sensor (1210) may be disposed at an upper side than thefirst image sensor (1110) to an optical axis direction. That is, thefirst image sensor (1110) may be disposed at a lower side than thesecond image sensor (1210) to the optical axis direction. In otherwords, the second image sensor (1210) may be disposed nearer to thecover member (1500, 1600) than the first image sensor (1110).Furthermore, the first image sensor (1110) may be disposed more distantfrom the cover member (1500, 1600) than the second image sensor (1210).To be more specific, the first image sensor (1110) may be mounted on afirst circuit layer (1310) and the second image sensor (1210) may bemounted on a second circuit layer (1320) disposed at an upper side ofthe first circuit layer (1310).

The second housing (1220) may be disposed between the substrate (1300)and the second cover member (1600). The second housing (1220) may formtherein a second inner side space (1230) to accommodate the second lensmodule (1240). The second inner side space (1230) may be formed insideof the second housing (1220). The inner side space (1230) may bedisposed between the substrate (1300) and the second cover member(1600). The second inner side space (1230) may be disposed with thesecond lens module (1240). The second inner side space (1230) may beformed with a moving space of the second lens module (1240) in order toperform the AF function.

The second lens module (1240) may be disposed at the second inner sidespace (1230). The second lens module (1240) may move to an optical axisdirection (vertical direction) in order to perform the AF function. Atthis time, the movement of the second lens module (1240) may beimplemented by electromagnetic interaction.

For example, the movement control of the second lens module (1240) maybe implemented by power application control relative to a coil while thesecond lens module (1240) is disposed with a magnet (not shown), and thesecond housing (1220) is disposed with a coil (not shown). Furthermore,the second lens module (1240) may be disposed with a coil and the secondhousing (1220) may be disposed with a magnet. The optical axis of thesecond lens module (1240) may match to that of the second image sensor(1210). The optical axis of the second lens module (1240) may be inparallel with that of the first lens module (1140).

The substrate (1300) may be mounted with the first image sensor (1110)of the first camera module (1100). Furthermore, the substrate (1300) maybe mounted with the second image sensor (1210) of the second cameramodule (1200). To be more specific, the first circuit layer (1310) ofthe substrate (1300) may be mounted with the first image sensor (1110).Furthermore, the second circuit layer (1320) of the substrate (1300) maybe mounted with the second image sensor (1210). The substrate (1300) maytransmit to an outside an image obtained through the first image sensor(1110) and/or the second image sensor (1210).

The substrate (1300) may supply a power to the camera module (1100,1200). Meantime, the substrate (1300) may be disposed with a controller(not shown) to control the camera module (1100, 1200). The controllermay be mounted on the substrate (1300). Meantime, the controller may bedisposed at an inside of the housing (1120, 1220). The controller maycontrol direction, intensity and amplitude of a current supplied to eachelement of the camera module (1100, 1200). The controller may perform atleast one of the AF function and handshake correction function bycontrolling the camera module (1100, 1200). That is, the controller maymove the lens module to an optical axis direction or to a directionperpendicular to the optical axis direction or tilt the lens module bycontrolling the camera module (1100, 1200). Furthermore, the controllermay perform a feedback control of AF function and handshake correctionfunction relative to the camera module (1100, 1200).

The substrate (1300) may include a first circuit layer (1310) and asecond circuit layer (1320) disposed at an upper side of the firstcircuit layer (1310). That is, the first circuit layer (1310) may bedisposed at an upper surface (1311) with a first image sensor (1110).The first circuit layer (1310) may be disposed at an upper surface(1311) with the second circuit layer (1320). Through this construction,the second image sensor (1210) mounted on the second circuit layer(1320) may be disposed higher than the first image sensor (1110) mountedon the first circuit layer (1310).

The second circuit layer (1320) may be mounted with the second imagesensor (1210) of the second camera module (1200). That is, the secondcircuit layer (1320) may be disposed at an upper surface (1321) with thesecond image sensor (1210). A bottom surface of the second circuit layer(1320) may be disposed on an upper surface (1311) of the first circuitlayer (1310). The second circuit layer (1320) may take a shape omittedat a portion corresponding to a portion where the first image sensor(1110) is mounted on the first circuit layer (1310). That is, the firstimage sensor (1110) may be mounted on a portion where a portion of thesecond circuit layer (1320) may be removed from the substrate (1300)stacked with the first circuit layer (1310) and the second circuit layer(1320).

The first cover member (1500) may be disposed at an upper side of thefirst camera module (1100). The first cover member (1500) may protectthe first camera module (1100) from an outside. Meantime, the firstcover member (1500) may form an exterior look of the dual camera module.The first cover member (1500) may be disposed with a first window part(1510). The first window part (1510) may be disposed with the firstcover member (1500). The first window part (1510) may have a narrowerarea than a second window part (1610). The first window part (1510) mayobtain a narrow view angle than the second window part (1610). The firstwindow part (1510) may be formed with a light-transmitting material.That is, the light having passed the first window part (1510) may beobtained by the first image sensor (1110) through a first lens module(1140). The second cover member (1600) may be disposed at an upper sideof the second camera module (1200). The second cover member (1600) mayprotect the second camera module (1200) from an outside.

Meantime, the second member (1600) may form an external look of the dualcamera module. The second cover member (1600) may be formed with aheight same as that of the first cover member (1500). The first covermember (1500) and the second cover member (1600) may be integrallyformed. The first cover member (1500) may be disposed with the firstwindow part (1510). The second cover member (1600) may be disposed withthe second window part (1610).

The second window part (1610) may be disposed with the second covermember (1600). The second window part (1610) may have an area broaderthan that of the first window part (1510). That is, a width (W21) of thesecond window part (1610) may be longer than a width (W11) of the firstwindow part (1510). The second window part (1610) may have a broaderarea than the first window part (1510) in order to obtain a broader viewangle than the first window part (1510). The second window part (1610)may be formed with a light-transmitting material. That is, the lighthaving passed the second window part (1610) may be obtained by thesecond image sensor (1210) through a second lens module (1240).

Previously, although the first cover member (1500) and the second covermember (1600) have been divisibly explained, the first cover member(1500) and the second cover member (1600) may be integrally formed. Inthis case, the first cover member (1500) and the second cover member(1600) may be called as a cover member (1500, 1600). Meantime, althoughthe cover member (1500, 1600) has been explained as one constitution ofthe dual camera module, the cover member (1500, 1600) may be explainedas an element separate from the dual camera module. For example, thecover member (1500, 1600) may form an external look of an opticalapparatus as one of the constitutional elements of optical apparatus.

The dual camera module according to another exemplary embodiment of thepresent invention may further comprise a connector (1700) connecting thecamera module (1100, 1200) with the cover member (1500, 1600). Theconnector (1700) may be interposed between the housing (1120, 1220) ofthe camera module (1100, 1200) and the cover member (1500, 1600). Theconnector (1700) may fix the housing (1120, 1220) to the cover member(1500, 1600). Meantime, the connector (1700) may fix the cover member(1500, 1600) to the housing (1120, 1220). The connector (1700) mayprovide a fixing power between the housing (1120, 1220) and the covermember (1500, 1600) and may perform a light-shielding effect, acushioning effect and a foreign object introduction prevention effect aswell. The connector (1700) may include a first connector (1710) and asecond connector (1720).

The first connector (1710) may be disposed between the first housing(1120) and the first cover member (1500). The first connector (1710) mayfix the first housing (1120) to the first cover member (1500). Meantime,the first connector (1710) may fix the first cover member (1500) to thefirst housing (1120).

The second connector (1720) may be disposed between the second housing(1220) and the second cover member (1600). The second connector (1720)may fix the second housing (1220) to the second cover member (1600).Meantime, the second connector (1720) may fix the second cover member(1600) to the second housing (1220).

Hereinafter, operation and effect of the dual camera module according toanother exemplary embodiment of the present invention will be describedwith the accompanying drawings.

FIGS. 4 and 5 are conceptual views illustrating a dual camera moduleaccording to a modification of another exemplary embodiment of thepresent invention.

The first camera module (1100) may be called as a narrow angle cameramodule (1100) because of having a narrower view angle over the secondcamera module (1200), and the second camera module (1200) may be calledas a wide angle camera module (1200) because of having a wider viewangle over the first camera module (1100). A lens module (1140) of thenarrow angle camera module (1100) may function as a telephoto lens, andthe lens module (1240) of wide angle camera module (1200) may functionas a wide angle lens.

First of all, the dual camera module can function while an optical axisof the first camera module (1100) and an optical axis of the secondcamera module (1200) are aligned. The dual camera module according to anexemplary embodiment of the present invention may output an imageobtained by the second camera module (1200) when a user photographs anobject of a short distance, and output an image obtained by the firstcamera module (1100) when a user photographs an object of a longdistance. Furthermore, the dual camera module according to an exemplaryembodiment of the present invention may output an image obtained by thefirst camera module (1100) and an image obtained by the second cameramodule (1200), based on the distance of an object, by combining theimage obtained by the first camera module (1100) and the image obtainedby the second camera module (1200).

That is, the dual camera module according to an exemplary embodiment ofthe present invention may obtain objects positioned in a long distanceor a close distance as images of clear quality. In other words, the dualcamera module (1100) according to an exemplary embodiment of the presentinvention can provide a corresponding function as that of a zoom lenseven without an zoom lens.

Furthermore, in the dual camera module according to an exemplaryembodiment of the present invention, the first image sensor (1110) ofthe first camera module (1100) is mounted on the first circuit layer(1310) of the substrate (1300), and the second image sensor (1210) ofthe second camera module (1200) is mounted on the second circuit layer(1320) of the substrate (1300), where the second circuit layer (1320) isadhered to an upper surface of the first circuit layer (1310), and as aresult, the first image sensor (1110) can be positioned closer to thecover member (1500, 1600) than the second image sensor (1210).

In this case, a width (w21) of the second window part (1610) that mustobtain a view angle, which is a wide angle of the second camera module(1200), may become relatively narrower. That is, because an area of thesecond window part (1610) is reduced, a phenomenon of an innerconfiguration of the second camera module (1200) being exposed throughthe second window part (1610) can be inhibited.

Furthermore, when the first image sensor (1110) is mounted on the secondcircuit layer (1320) of the substrate (1300), a height of the secondhousing (1220) may also become lowered to increase a height of the covermember (1500, 1600) altogether. In this case, a separate additionalmember for fixing the Poron between the second housing (1220) and thesecond cover member (1600) may be required. However, in the dual cameramodule according to an exemplary embodiment of the present invention, adistance between an upper end of the second housing (1200) and thesecond cover member (1600) can be shortened compared to the previouscomparative example to advantageously fix the Poron without a separateadditional member between the second housing (1220) and the second covermember (1600).

Hereinafter, configuration of dual camera module according to amodification of another exemplary embodiment of the present inventionwill be described with reference to the accompanying drawings.

FIG. 6 is a conceptual view illustrating a dual camera module accordingto a modification of another exemplary embodiment of the presentinvention.

Referring to FIG. 6, the dual camera module according to a modificationof another exemplary embodiment of the present invention may include afirst camera module (1100), a second camera module (1200), a substrate(1300), a first cover member (1500), a second cover member (1600), and aconnector (1700). However, in the modification of another exemplaryembodiment of the present invention, at least any one of the elements inthe first camera module (1100), the second camera module (1200), thesubstrate (1300), the first cover member (1500), the second cover member(1600), and the connector (1700) may be omitted.

The dual camera module according to the modification of anotherexemplary embodiment of the present invention may be different from thepreviously explained other exemplary embodiments of the presentinvention in terms of mounting method of dual camera module and thefirst image sensor (1110). Meantime, elements not explained hereinafterin the dual camera module according to the modification of anotherexemplary embodiment of the present invention may be inferred from thedual camera module according to the other exemplary embodiments of thepresent invention.

The first image sensor (1110) of the first camera module (1100) in thedual camera module according to the modification of another exemplaryembodiment of the present invention may be mounted on the substrate(1300) by way of flip-chip method. For example, the second image sensor(1210) may be mounted at an upper surface (1321) of the second circuitlayer (1320) at the substrate (1300), and the first image sensor (1110)may be mounted on a bottom surface (1321) of the second circuit layer(1320) at the substrate (1300). In this case, the first circuit layer(1310) may omit a portion corresponding to a portion where the firstimage sensor (1110) is mounted at the second circuit layer (1320).Meantime, the second circuit layer (1320) may be formed with a throughhole (1325) in order to allow a light having passed the first lensmodule (1140) to be obtained by the first image sensor (1110) flip-chipbonded to the second circuit layer (1320). That is, the light havingtransmitted the first lens module (1140) can reach the first imagesensor (1110) through the through hole (1325) of the second circuitlayer (1320).

In the dual camera module according to the modification of anotherexemplary embodiment of the present invention may be such that the firstimage sensor (1110) is disposed at a bottom side of the second imagesensor (1210), as in the dual camera module according to the otherexemplary embodiments of the present invention. Thus, even in the dualcamera module according to the modification of another exemplaryembodiment of the present invention, relevant effects such asminimization of inner structure exposure and easy attachment of Poronmay be accomplished.

Hereinafter, configuration of optical apparatus according to stillanother exemplary embodiment will be explained.

The optical apparatus according to a still another exemplary embodimentof the present invention may be a hand phone, a mobile phone, a smartphone, a portable smart device, a digital camera, a notebook computer(laptop computer), a PMP (Portable Multimedia Player) and a navigationdevice. However, the present invention is not limited thereto, and mayinclude any device capable of photographing an image or a photograph.

The optical apparatus according to still another exemplary embodiment ofthe present invention may include a main body(not shown), a display part(not shown) arranged at one surface of the main body to displayinformation, and a camera having a dual camera module (not shown)disposed at the main body to photograph an image or a photograph.

Hereinafter, configuration of dual camera module according to stillanother exemplary embodiment of the present invention will be described.

FIGS. 7 and 8 are conceptual views illustrating a dual camera moduleaccording to a modification of still another exemplary embodiment of thepresent invention.

Referring to FIGS. 7 and 8, the dual camera module according to stillanother exemplary embodiment of the present invention may include afirst camera module (2100) and a second camera module (2200). Meantime,the dual camera module according to still another exemplary embodimentof the present invention may further include a first cover member (notshown) to cover the first camera module (2100). Furthermore, the dualcamera module according to still an exemplary embodiment of the presentinvention may further include a second cover member (not shown) to coverthe second camera module (2200).

In addition, the dual camera module according to still another exemplaryembodiment of the present invention may further include a firstsubstrate (2300) mounted with a first image sensor (2110) of the firstcamera module (2100). Furthermore, the dual camera module according tostill another exemplary embodiment of the present invention may furtherinclude a second substrate (2400) mounted with a second image sensor(2210) of the second camera module (2200).

Here, the first cover member and the first substrate (2300) may beformed by using the first camera module (2100), and may be also formedby a member separate from the first camera module (2100). Furthermore,the second cover member and the second substrate (2400) may be formed byusing the second camera module (2200), and may be also formed by amember separate from the second camera module (2200). Furthermore, thedual camera module according to still another exemplary embodiment ofthe present invention may further include a third substrate (2500)electrically connected to the first substrate (2300). Furthermore, afourth substrate (2600) electrically connected to the second substrate(2400) may be further included. Still furthermore, a cavity (2700)accommodating at least a portion of the third substrate (2500) may befurther included by being formed at the first substrate (2300).

The first camera module (2100) may be a narrow angle camera module. Inother words, the first camera module (2100) may be narrower in viewangle than the second camera module (2200). That is, a view angle (012)of the first camera module (2100) may be narrower than a view angle(022) of the second camera module (2200). An EFL (B12) of the firstcamera module (2100) may be longer than an EFL (B22) of the secondcamera module (2200). Furthermore, a TTL (C12) of the first cameramodule (2100) may be longer than a TTL (C22) of the second camera module(2200).

The first camera module (2100) may include a first image sensor (2110),a first housing (2120), a first inner side space (2130) and a first lensmodule (2140).

The first image sensor (2110) may obtain a light incident through afirst lens module (2140) of the first camera module (2100). The firstimage sensor (2110) may be mounted on the first substrate (2300). Thefirst image sensor (2110) may be so disposed as to match with the firstlens module (2140) at the optical axis, whereby the first image sensor(2110) can output a light as an image by obtaining the light havingpassed the first lens module (2140). The first image sensor (2110), maybe a CCD (Charge Coupled Device), a MOS (Metal Oxide Semiconductor), aCPD or a CID, for example. However, the present invention is not limitedto the given types of image sensor and may include other types of imagesensors.

A first housing (2120) may be disposed between the first substrate(2300) and the first cover member. The first housing (2120) may formtherein a first inner side space (2130) to accommodate the first lensmodule (2140). The first inner side space (2130) may be interposedbetween the first substrate (2300) and the first cover member. The firstinner side space (2130) may be disposed with the first lens module(2140). The first inner side space (2130) may be so formed as to obtaina moving space of the first lens module (2140) in order to perform theAF function. The moving space of the first lens module (2140) may beformed by a connector (not shown) disposed between the first covermember and the first housing (2120).

The first lens module (2140) may be disposed at the first inner sidespace (2130). The first lens module (2140) may move to an optical axisdirection (vertical direction) in order to perform the AF function. Atthis time, the movement of the first lens module (2140) may be performedby the electromagnetic interaction.

For example, the movement control of the first lens module (2140) may beimplemented through a power application control to a coil by allowingthe first lens module (2140) to be disposed with a magnet (not shown),and the first housing (2120) to be disposed with the coil (not shown).Furthermore, the first lens module (2140) may be disposed with the coiland the first housing (2120) may be disposed with a magnet. The opticalaxis of the first lens module (2140) may match an optical axis of thefirst image sensor (2110). The optical axis of the first lens module(2140) may be parallel with an optical axis of a second lens module(2240).

The first lens module (2140) may move to a vertical direction which isan optical axis direction in order to perform the AF function.Furthermore, an upper end of the first lens module (2140) may fartherprotrude over an upper end of the first housing (2120) in response tothe movement of the first lens module (2140).

In still another example of the present invention, a connector may beinterposed between the cover member and the first housing (2120) inorder to secure a moving space of the first lens module (2140). That is,the connector may expand a movable space of the first lens module(2140).

The second camera module (2200) may be a wide angle camera module. Inother words, the second camera module (2200) may be wider in view anglethan the first camera module (2100). That is, a view angle (022) of thesecond camera module (2200) may be wider than a view angle (012) of thefirst camera module (2100). An EFL (B22) of the second camera module(2200) may be shorter than an EFL (B12) of the first camera module(2100). Furthermore, a TTL (C22) of the second camera module (2200) maybe shorter than a TTL (C12) of the first camera module (2100).

The second camera module (2200) may be arranged in parallel with thefirst camera module (2100). An optical axis of the second camera module(2200) may be aligned with an optical axis of the first camera module(2100). The optical axis of the second camera module (2200) may be inparallel with the optical axis of the first camera module (2100). Thesecond camera module (2200) may be spaced apart from the first cameramodule (2100). Furthermore, the second camera module (2200) may be sodisposed as to abut the first camera module (2100).

The second camera module (2200) may include a second image sensor(2210), a second housing (2220), a second inner side space (2230) and asecond lens module (2240).

The second image sensor (2210) may obtain a light incident through asecond lens module (2240) of the second camera module (2200). The secondimage sensor (2210) may be mounted on the second substrate (2400). Thesecond image sensor (2210) may be so disposed as to match with thesecond lens module (2240) at the optical axis, whereby the second imagesensor (2210) can output a light as an image by obtaining the lighthaving passed the second lens module (2240). The second image sensor(2210) may be a CCD (Charge Coupled Device), a MOS (Metal OxideSemiconductor), a CPD or a CID, for example. However, the presentinvention is not limited to the given types of image sensors and mayinclude other types of image sensors.

The second housing (2220) may be disposed between the second substrate(2400) and the second cover member. The second housing (2220) may formtherein a second inner side space (2230) to accommodate the second lensmodule (2240). The second inner side space (2230) may be formed insideof the second housing (2220).

The inner side space (2230) may be disposed between the second substrate(2400) and the second cover member. The second inner side space (2230)may be disposed with the second lens module (2240). The second innerside space (2230) may be formed with a moving space of the second lensmodule (2240) in order to perform the AF function.

The second lens module (2240) may be disposed at the second inner sidespace (2230). The second lens module (2240) may move to an optical axisdirection (vertical direction) in order to perform the AF function. Atthis time, the movement of the second lens module (2240) may beimplemented by electromagnetic interaction. For example, the movementcontrol of the second lens module (2240) may be implemented by powerapplication control relative to the coil while the second lens module(2240) is disposed with a magnet (not shown), and the second housing(2220) is disposed with a coil (not shown). Furthermore, the second lensmodule (2240) may be disposed with a coil and the second housing (2220)may be disposed with a magnet. The optical axis of the second lensmodule (2240) may match to that of the second image sensor (2210). Theoptical axis of the second lens module (2240) may be in parallel withthat of the first lens module (2140).

The first substrate (2300) may be mounted with the first image sensor(2110) of the first camera module (2100). That is, the first substrate(2300) may transmit an image to an outside by outputting the imageobtained through the first image sensor (2110). An upper surface (2310)of the first substrate (2300) may be mounted with the first image sensor(2110). The upper surface (2310) of the first substrate (2300) may bemounted with a second substrate (2400). Through this configuration, thesecond image sensor (2210) of the second substrate (2400) may bedisposed higher than the first image sensor (2110) mounted on the firstsubstrate (2300). That is, the second image sensor (2210) may bedisposed closer to the cover members than the first image sensor (2110).

The first substrate (2300) may supply a power to the first camera module(2100). Meantime, the first substrate (2300) may be disposed with afirst controller (not shown) in order to control the first camera module(2100). The first controller may be mounted on the first substrate(2300). The first controller may be disposed at an inside of the firsthousing (2120).

Meantime, the first controller may control a direction, intensity andamplitude of current supplied to each component forming the first cameramodule (2100). The first controller may perform at least one of the AFfunction and a handshake correction function of the camera module bycontrolling the first camera module (2100). That is, the firstcontroller may move the lens module to an optical axis direction or to adirection perpendicular to the optical axis direction or tilt the lensmodule by controlling the first camera module (2100). Furthermore, thefirst controller may perform a feedback control of AF function andhandshake correction function relative to the first camera module(2100). Alternatively, the first controller may be disposed outside ofthe first substrate (2300). In this case, the first controller and thefirst substrate (2300) may be electrically conducted by the thirdsubstrate (2500). The first substrate (2300) may be 0.4 to 0.6 mm in avertical thickness.

An adhesive (2350) may be interposed between the first substrate (2300)and the second substrate (2400). The adhesive (2350) may fix the secondsubstrate (2400) to the first substrate (2300). The second substrate(2400) may be such that an optical axis alignment with the firstsubstrate (2300) can be adjusted in the course of adhering the firstsubstrate (2300) using the adhesive (2350). That is, an alignmentbetween an optical axis of the first camera module (2100) and an opticalaxis of the second camera module (2200) may be adjusted by the adhesive(2350). For example, the second substrate (2400) may be movably adheredto the first substrate (2300) using an initially hardened adhesive(2350) where the optical axis may be aligned and the second substrate(2400) may be fixed by using a finally hardened adhesive (2350). Theadhesive (2350) may be a non-conductive material, for example. That is,the first substrate (2300) and the second substrate (2400) may not beelectrically conductive.

The second substrate (2400) may be mounted with the second image sensor(2210) of the second camera module (2200). That is, the second substrate(2400) may transmit an image obtained through the second image sensor(2210) to an outside. The second substrate (2400) may be mounted at anupper surface (2410) with the second image sensor (2210). The secondsubstrate (2400) may be adhered at a bottom surface to the second imagesensor (2310) of the first substrate (2300). Through this configuration,the second image sensor (2410) mounted on the second substrate (2400)may be more closely positioned to the cover member than the first imagesensor (2110) mounted on the first substrate (2300).

The second substrate (2400) may supply a power to the second cameramodule (2200). Meantime, the second substrate (2400) may be disposedwith a second controller (not shown) in order to control the secondcamera module (2200). The second controller may be mounted on the secondsubstrate (2400). Meantime, the second controller may be disposed at aninner side of the second housing (2220).

The second controller may control a direction, intensity and amplitudeof a current supplied to each component forming the second camera module(2200). The second controller may perform at least one of the AFfunction and a handshake correction function of the camera module bycontrolling the second camera module (2200). That is, the secondcontroller may move the lens module to an optical axis direction or to adirection perpendicular to the optical axis direction or tilt the lensmodule by controlling the second camera module (2200). Furthermore, thesecond controller may perform a feedback control of AF function andhandshake correction function relative to the second camera module(2200). Alternatively, the second controller and the second substrate(2400) may be electrically conducted. The second substrate (2400) may be0.4 to 0.6 mm at a vertical thickness.

The third substrate (2500) may be electrically conducted with the firstsubstrate (2300). The third substrate (2500) may electrically connectelements of the optical apparatus with the first substrate (2300). Here,the elements of the optical apparatus may be a controller and a powersource. At least one portion of the third substrate (2500) may beaccommodated into a cavity (2700) formed at the first substrate (2300).The third substrate (2500) may include a coupling part (2510)accommodated into the cavity (2700).

The first substrate (2300) may have rigidity and the third substrate(2500) may have flexibility. That is, the first substrate (2300) may bea rigid PCB (Printed Circuit Board), and the third substrate (2500) maybe a flexible PCB. Meantime, the second substrate (2400) may be a rigidPCB (Printed Circuit Board), and the fourth substrate (2600) may be aflexible PCB. However, the first substrate (2300) may be bonded to thethird substrate (2500) by an ACF (Anisotropic Conductive Film), and thesecond substrate (2400) and the fourth substrate (2600) may be formedwith a rigid flexible PCB. Meantime, the reason of bonding the firstsubstrate (2300) and the third substrate (2500) is that the firstsubstrate (2300) requires a hard material such as a ceramic PCB in orderto minimize the flatness and bending. That is, the first substrate(2300) may be a ceramic PCB.

The coupling part (2510) may be coupled with the first substrate (2300)using the ACF. Here, the ACF may be a conductive film in a film state bymixing fine conductive particles with adhesive resin. The coupling part(2510) may be bonded to a cavity surface (2710) forming the cavity(2700) in the first substrate (2300). For example, the coupling part(2510) may be interposed between an adhesive (2350) and the firstsubstrate (2300), for example. That is, at least one portion of thethird substrate (2500) may be interposed between the adhesive (2350) andthe first substrate (2300). However, the coupling part (2510) may bedisposed at a bottom surface of the first substrate (2300), in anotherexample. Meantime, the first substrate (2300), the third substrate(2500) and the coupling part (2510) may be overlapped to a verticaldirection. That is, the first substrate (2300), the third substrate(2500) and the coupling part (2510) may be vertically overlapped atleast at one portion.

The fourth substrate (2600) may be electrically connected to the secondsubstrate (2400). The fourth substrate (2600) may be electricallyconnected to elements of optical apparatus. Here, the elements of theoptical apparatus may be a controller and a power source. The secondsubstrate (2400) may have rigidity and the fourth substrate (2600) mayhave flexibility. At this time, the second substrate (2400) and thefourth substrate (2600) may be integrally formed to form a rigidflexible PCB. Alternatively, both the second substrate (2400) and thefourth substrate (2600) may be integrally formed with a flexible PCB.

The cavity (2700) may be formed at the first substrate (2300). Thecavity (2700) may take a form omitted at one portion of the firstsubstrate (2300). The cavity (2700) may accommodate at least one portionof the third substrate (2500). The cavity (2700) may be disposed at anupper surface of the first substrate (2300), for example. That is, thecavity (2700) may take a shape of a portion at an upper surface of thecavity (2700) being concaved. Alternatively, the cavity (2700) may bedisposed at a bottom surface of the first substrate (2300), as anotherexample. That is, the cavity (2700) may take a shape of a portion of thebottom surface at the first substrate (2300) being upwardly concaved. avertical thickness of the cavity (2700) may be 0.2 to 0.3 mm. That is,the vertical thickness of the cavity (2700) may be half the size of avertical thickness of the first substrate (2300) and the secondsubstrate (2400). Furthermore, the vertical thickness of the cavity(2700) may correspond to a vertical thickness of the third substrate(2500). A width or an area of the cavity (2700) may be formed to securea space for ACF bonding of the third substrate (2500) and the firstsubstrate (2300).

A cavity surface (2710) may be used as an upper surface or a bottomsurface of the first substrate (2300) forming the cavity (2700). Thecavity surface (2710) may be bonded by the coupling part (2510) of thethird substrate (2500). To be more specific, the coupling part (2510) ofthe cavity surface (2710) may be couple by the ACF.

The first cover member may be disposed at an upper side of the firstcamera module (2100). The first cover member may protect the firstcamera module (2100) from outside. Meanwhile, the first cover member mayform an external look of the dual camera module. The first cover membermay be disposed with a first window part (not shown).

The first window part may be disposed on the first cover member. Thefirst window part may have a narrower area than a second window part(not shown). This is for the first window part to obtain a narrower viewangle than the second window part. The first window part may be formedwith a material capable of transmitting a light. That is, a light havingpassed the first window part may be obtained by the first image sensor(2110) through the first lens module (2140).

The second cover member may be disposed at an upper side of the secondcamera module (2200). The second cover member may protect the secondcamera module (2200) from the outside. Meantime, the second cover membermay form an external look of the dual camera module. The second covermember may be formed to have a same height as that of the first covermember. The first cover member and the second cover member may beintegrally formed. The first cover member may be disposed with a firstwindow part. The second cover member may be disposed with a secondwindow part.

The second window part may be disposed at the second cover member. Thesecond window part may have a broader area than the first window part.That is, a width of the second window part may be longer than a width ofthe first window part. The second window part may have a broader areathan the first window part. This is for the second window part to obtaina wider view angle than the first window part. The second window partmay be formed with a material capable of transmitting a light. That is,a light having passed the second window part may be obtained by thesecond image sensor (2210) through the second lens module (2240).

Although the foregoing description has explained the present inventionby dividing the first cover member and the second cover member, thefirst cover member and the second cover member may be integrally formed.In this case, the first cover member and the second cover member may becalled as cover member. Meantime, although the cover member has beenexplained as one configuration of the dual camera module, the covermember may be separately configured. For example, the cover member mayform an external look of the optical apparatus as one constitutionalelement.

The dual camera module according to still another exemplary embodimentof the present invention may further comprise a camera module (2100,2200) and a connector connecting the cover members.

The connector may be interposed between the housing (2120, 2220) of thecamera module (2100, 2200) and the cover member. The connector may fixthe housing (2120, 2220) to the cover member. Meantime, the connectormay fix cover member to the housing (2120, 2220). The connector may be aPoron, for example. In this case, the connector formed with the Poronmay not only provide a fixing power to the housing (2120, 2220) and tothe cover member but also perform a light shield effect, a cushioningeffect and a foreign object prevention effect.

Hereinafter, operation and effect of the dual camera module according tostill another exemplary embodiment of the present invention will bedescribed with reference to the accompany drawings.

FIGS. 7 and 8 are conceptual views illustrating a dual camera moduleaccording to a modification of still another exemplary embodiment of thepresent invention.

The first camera module (2100) may be called as a narrow angle cameramodule (2100) because of having a narrower view angle than the secondcamera module (2200), and then second camera module (2200) may be calledas wide angle camera module (2200) because of having a wider view anglethan the first camera module (2100). A lens module (2140) of the narrowangle camera module (2100) may function as a telephoto lens, and a lensmodule (2240) of wide angle camera module (2200) may function as a wideangle lens.

First of all, the dual camera module can function while an optical axisof the first camera module (2100) and an optical axis of the secondcamera module (2200) are aligned. The dual camera module according tostill another exemplary embodiment of the present invention may outputan image obtained by the second camera module (2200) when a userphotographs an object of a short distance, and output an image obtainedby the first camera module (2100) when a user photographs an object of along distance. Furthermore, the dual camera module according to stillanother exemplary embodiment of the present invention may output animage obtained by the first camera module (2100) and an image obtainedby the second camera module (2200), based on the distance of an object,by combining the image obtained by the first camera module (2100) andthe image obtained by the second camera module (2200).

That is, the dual camera module (2100) according to still anotherexemplary embodiment of the present invention may obtain objectspositioned in a long distance or a close distance as images of clearquality. In other words, the dual camera module (2100) according tostill another exemplary embodiment of the present invention can providea corresponding function as that of a zoom lens even without an zoomlens.

Furthermore, the first image sensor (2110) of the first camera module(2100) may be mounted on the first substrate (2300) and the second imagesensor (2210) of the second camera module (2200) is mounted on thesecond substrate (2400) in the dual camera module according to stillanother exemplary embodiment of the present invention, where the secondsubstrate (2400) is adhered to an upper surface of the first substrate(2300), and as a result, the first image sensor (2110) can be positionedcloser to the cover member than the second image sensor (2210).

In this case, a width of the second window part that must obtain a viewangle, which is a wide angle of the second camera module (2200), maybecome relatively narrower {compared with a case where the second imagessensor (2110) is mounted on the first substrate (2300)}. That is, anarea of the second window part may be reduced, whereby a phenomenon ofan inner configuration of the second camera module (2200) being exposedthrough the second window part can be inhibited.

Furthermore, in the dual camera module according to still anotherexemplary embodiment of the present invention, the third substrate(2500) for electric conductibility with an outside may be ACF-bonded tothe first substrate (2300) formed with a hard material such as a ceramicPCB in order to minimize the flatness and bending, where the cavity(2700) omitted of a portion of the first substrate (2300) isaccommodated by a portion of the third substrate (2500), to which thefirst substrate (2300) and the portion of the third substrate (2500) areACF-bonded to thereby minimize a total length of the dual camera module.

Particularly, the first substrate (2300) is not formed with the cavity(2700), but the first substrate (2300) is extended to the outside, atwhich, when compared with a case of the third substrate (2500) beingACF-bonded at the extended portion, the reduced total length of the dualcamera module according to still another exemplary embodiment of thepresent invention can be clearly recognized.

Although the present disclosure has been explained with all constituentelements forming the exemplary embodiments of the present disclosurebeing combined in one embodiment, or being operated in one embodiment,the present disclosure is not limited thereto. That is, in some cases,the described features, structures, or operations may be combined in anysuitable manner in one or more embodiments. It will also be readilyunderstood that the components of the embodiments, as generallydescribed and illustrated in the figures herein, could be arranged anddesigned in a wide variety of different configurations.

Terms used in the specification are only provided to illustrate theembodiments and should not be construed as limiting the scope and spiritof the present disclosure. In the specification, a singular form ofterms includes plural forms thereof, unless specifically mentionedotherwise. In the term “includes”, “including”, “comprises” and/or“comprising” as used herein, the mentioned component, step, operationand/or device is not excluded from presence or addition of one or moreother components, steps, operations and/or devices.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims.

Although the abovementioned embodiments according to the presentinvention have been described in detail with reference to the abovespecific examples, the embodiments are, however, intended to beillustrative only, and thereby do not limit the scope of protection ofthe present invention. Thereby, it should be appreciated by the skilledin the art that changes, modifications and amendments to the aboveexamples may be made without deviating from the scope of protection ofthe invention.

1. A camera device comprising: a first camera module; and a secondcamera module having an angle of view wider than does the first cameramodule, wherein the first camera module comprises a first substrate, afirst image sensor disposed on the first substrate, and a first lensdisposed on the first image sensor, wherein the second camera modulecomprises a second substrate, a second image sensor disposed on thesecond substrate, and a second lens disposed on the second image sensor,wherein a lower surface of the first substrate and a lower surface ofthe second substrate are disposed at the same height, wherein the firstsubstrate comprises a groove concavely formed on an upper surface of thefirst substrate, and wherein the first image sensor is disposed on thegroove of the first substrate.
 2. The camera device of claim 1, whereinan upper surface of the first image sensor is disposed lower than anupper surface of the second image sensor.
 3. The camera device of claim1, wherein the upper surface of the first substrate and an upper surfaceof the second substrate are disposed at the same height.
 4. The cameradevice of claim 1, wherein, in an optical axis direction of the firstlens, a thickness of the first image sensor is thinner than a depth ofthe groove of the first substrate.
 5. The camera device of claim 1,wherein, in a direction perpendicular to an optical axis of the firstlens, the first image sensor is overlapped with the second substrate. 6.The camera device of claim 1, wherein the first substrate comprises afirst circuit layer and a second circuit layer disposed on an uppersurface of the first circuit layer, and wherein the groove of the firstsubstrate passes through the second circuit layer in an optical axisdirection of the first lens so that the first image sensor is disposedon the upper surface of the first circuit layer.
 7. The camera device ofclaim 1, wherein the groove of the first substrate is formed by removinga portion of an upper portion of the first substrate.
 8. The cameradevice of claim 1, wherein a distance between the first image sensor andthe first lens is greater than a distance between the second imagesensor and the second lens.
 9. The camera device of claim 1, wherein, inan optical axis direction of the first lens, a thickness of the firstsubstrate overlapped with the first image sensor is thinner than athickness of the second substrate overlapped with the second imagesensor.
 10. The camera device of claim 1, wherein an EFL (EffectiveFocal Length) or TTL (Total Track Length) of the second camera module isshorter than that of the first camera module.
 11. The camera device ofclaim 1, wherein an upper end of a housing of the first camera moduleand an upper end of a housing of the second camera module are disposedat the same height.
 12. The camera device of claim 6, wherein athickness of each of the first circuit layer and the second circuitlayer is 0.2 to 0.3 mm.
 13. The camera device of claim 1, wherein thefirst camera module comprises a housing disposed on the first substrate,wherein the first lens is disposed in the housing, wherein the firstlens is configured to move in an optical axis direction of the firstlens for an auto focus function, and wherein an upper end of the firstlens is disposed higher than an upper end of the first housing when thefirst lens moves upwards.
 14. The camera device of claim 1, wherein thefirst camera module and the second camera module are spaced apart fromeach other.
 15. An optical apparatus comprising: a main body; the cameradevice of claim 1 disposed on the main body; and a display disposed onthe main body and configured to output an image photographed by thecamera device.
 16. The optical apparatus of claim 15, wherein the mainbody comprises a cover member disposed on the first camera module andthe second camera module, wherein a distance between the first imagesensor and the cover member is greater than a distance between thesecond image sensor and the cover member.
 17. The optical apparatus ofclaim 16, comprising a connection member disposed between the firstcamera module and the cover member and fixing the first camera module tothe cover member, wherein the connection member comprises a Poron. 18.The optical apparatus of claim 16, comprising: a first window portiondisposed on the cover member and through which transmitted light travelsto the first camera module; and a second window portion disposed on thecover member and through which transmitted light travels to the firstcamera module, wherein the second window portion has a larger area thandoes the first window portion in a cross section perpendicular to anoptical axis of the first lens.
 19. A camera device comprising: a firstcamera module; and a second camera module having an angle of view widerthan does the first camera module, wherein the first camera modulecomprises a first substrate, a first image sensor disposed on the firstsubstrate, and a first lens disposed on the first image sensor, whereinthe second camera module comprises a second substrate, a second imagesensor disposed on the second substrate, and a second lens disposed onthe second image sensor, wherein a lower surface of the first substrateand a lower surface of the second substrate are disposed at the sameheight, and wherein an upper surface of the first image sensor isdisposed lower than an upper surface of the second image sensor.
 20. Acamera device comprising: a first camera module; and a second cameramodule having an angle of view wider than does the first camera module.